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Interconnection
Key Winning Features
High Integration Density
Interconnection technologies such as resistance and laser welding as well as micro soldering or ball-stud bonding (microflex interconnection) allow high integration densities.
Together with highly skilled manual cable manufacturing we can provide increased channel counts per cable compared to other manufacturers.
High Variability
CorTec’s interconnection technologies permit a combination of versatile electrode and substrate materials. Almost any electrode material can be interconnected — from a variety of flexible wires to rigid FR4 substrates for PCBs or even ceramics.
Reliable Process Portfolio
A wide range of processes are validated for the most common material combinations. Equally high standards for customer individual solutions are guaranteed.
Reliability Testing
Continuous monitoring of processes and repeated testing allow the creation of cutting-edge interconnection solutions of highest reliability and stability in their biological environment.
Functionality Enhancement of Commercially Available Solutions
Commercially available connectors can be customized with interconnections such as our flat ribbon cables to create new solutions for previously unsolved implant wiring challenges.
Dimensions & Manufacturing
Dimensions
- Minimum cable diameter: 0.65 mm (outer diameter)
- Maximum wire counts:
Bundled straight wires: varies with configuration
Coil winding cables: 18 wires - Maximum lengths:
Bundled straight wires: 1.5 m
Coil winding cables: 1 m - Other dimensions available in cooperation with external partners
Cable Manufacturing
- Bundled straight wires
- Coil winding cables
- Ribbon cables
Research Standard Connectity
- ZIF connectors
- Omnetics connectors
- Harwin connectors
- Molex connectors
- Other connector types can be attached upon request
- Open cable ends – for highest flexibility in individual interconnection applications
Medical Standard Connectity
- IS-1
- IS-4
- DF-1
- DF-4
- Bal Seal
Interconnection Technologies
- Ball-stud bonding
Interconnection option for connecting electrode arrays to printed circuit boards (PCB)
- Laser welding
Common method for connecting wires to metal parts such as sleeves or platelets
- Spot welding
Common method for connecting wires to laser-patterned metal foil
(e.g., contact area of AirRay™ electrodes)
- Parallel gap welding
Standard interconnection for connecting wires to PCBs
- Micro soldering
Standard procedure for connecting wires to connectors or PCBs
More technical Information
Materials
Wires
- Platinum-Iridium (90/10)
- MP35N
- MP-DFT Ag (silver core)
- Gold
Insulation
- Polyesterimide
- Fluorpolymer
- Silicone
Substrates
- Printed Circuit Board, e.g. FR4
- Screen printed ceramics
- Other materials upon request
Performance
Our interconnections are tested to fulfill different standards in the medical device industry (e.g. EN 45502-2-3 or ISO 14708-1) to guarantee highest reliability.
Mechanical Characterization
Bending tests (cyclic loads)
Tensile or shear tests
For particularly challenging mechanical requirements we are happy to engineer strain relieving concepts for your individual interconnection solution.
Electrochemical Characterization
Impedance analysis (usually together with electrodes)
Corrosion tests
Related Services
- Functionality testing
- Electrochemical testing
- Mechanical testing
- Aging and accelerated aging tests
- Reliability testing
- Tests and validations incl. technical documentation
- Design studies
- Process validation
- More connectivity options in cooperation with external partners