Key Winning Features

High Integration Density

Interconnection technologies such as resistance and laser welding as well as micro soldering or ball-stud bonding (microflex interconnection) allow high integration densities.
Together with highly skilled manual cable manufacturing we can provide increased channel counts per cable compared to other manufacturers.

High Variability

CorTec’s interconnection technologies permit a combination of versatile electrode and substrate materials. Almost any electrode material can be interconnected — from a variety of flexible wires to rigid FR4 substrates for PCBs or even ceramics.

Reliable Process Portfolio

A wide range of processes are validated for the most common material combinations. Equally high  standards for customer individual solutions are guaranteed.

Reliability Testing

Continuous monitoring of processes and repeated testing allow the creation of cutting-edge interconnection solutions of highest reliability and stability in their biological environment.

Functionality Enhancement of Commercially Available Solutions

Commercially available connectors can be customized with interconnections such as our flat ribbon cables to create new solutions for previously unsolved implant wiring challenges.

Dimensions & Manufacturing


  • Minimum cable diameter: 0.65 mm (outer diameter)
  • Maximum wire counts:
    Bundled straight wires: varies with configuration
    Coil winding cables: 18 wires
  • Maximum lengths:
    Bundled straight wires: 1.5 m
    Coil winding cables: 1 m
  • Other dimensions available in cooperation with external partners

Cable Manufacturing

  • Bundled straight wires
  • Coil winding cables
  • Ribbon cables

Research Standard Connectity

  • ZIF connectors
  • Omnetics connectors
  • Harwin connectors
  • Molex connectors
  • Other connector types can be attached upon request
  • Open cable ends – for highest flexibility in individual interconnection applications

Medical Standard Connectity

  • IS-1
  • IS-4
  • DF-1
  • DF-4
  • Bal Seal

Interconnection Technologies

  • Ball-stud bonding
    Interconnection option for connecting electrode arrays to printed circuit boards (PCB)
  • Laser welding
    Common method for connecting wires to metal parts such as sleeves or platelets
  • Spot welding
    Common method for connecting wires to laser-patterned metal foil
    (e.g., contact area of AirRay™ electrodes)
  • Parallel gap welding
    Standard interconnection for connecting wires to PCBs
  • Micro soldering
    Standard procedure for connecting wires to connectors or PCBs

Our new CorTec Business Catalogue

More technical Information



  • Platinum-Iridium (90/10)
  • MP35N
  • MP-DFT Ag (silver core)
  • Gold


  • Polyesterimide
  • Fluorpolymer
  • Silicone


  • Printed Circuit Board, e.g. FR4
  • Screen printed ceramics
  • Other materials upon request


Our interconnections are tested to fulfill different standards in the medical device industry (e.g. EN 45502-2-3 or ISO 14708-1) to guarantee highest reliability.


Mechanical Characterization

  • Bending tests (cyclic loads)

  • Tensile or shear tests

For particularly challenging mechanical requirements we are happy to engineer strain relieving concepts for your individual interconnection solution.


Electrochemical Characterization

  • Impedance analysis (usually together with electrodes)

  • Corrosion tests

Related Services

  • Functionality testing
  • Electrochemical testing
  • Mechanical testing
  • Aging and accelerated aging tests
  • Reliability testing
  • Tests and validations incl. technical documentation
  • Design studies
  • Process validation
  • More connectivity options in cooperation with external partners