To make sure your implants benefit from the innovation of our components we are building on industry standards of connectivity options. Apart from the technologies we can realize in-house, we have a large network of partners available to offer the full range of solutions according to your requirements.

Key Winning Features

High Integration Density

Interconnection technologies such as resistance and laser welding as well as micro soldering or ball-stud bonding (microflex interconnection) allow high integration densities.
Together with highly skilled manual cable manufacturing we can provide increased channel counts per cable compared to other manufacturers.

High Variability

CorTec’s interconnection technologies permit a combination of versatile electrode and substrate materials. Almost any electrode material can be interconnected — from a variety of flexible wires to rigid FR4 substrates for PCBs or even ceramics.

Reliable Process Portfolio

A wide range of processes are validated for the most common material combinations. Equally high  standards for customer individual solutions are guaranteed.

Reliability Testing

Continuous monitoring of processes and repeated testing allow the creation of cutting-edge interconnection solutions of highest reliability and stability in their biological environment.

Functionality Enhancement of Commercially Available Solutions

Commercially available connectors can be customized with interconnections such as our flat ribbon cables to create new solutions for previously unsolved implant wiring challenges.

Dimensions & Manufacturing


  • Minimum cable diameter: 0.65 mm (outer diameter)
  • Maximum wire counts:
    Bundled straight wires: varies with configuration
    Coil winding cables: 18 wires
  • Maximum lengths:
    Bundled straight wires: 1.5 m
    Coil winding cables: 1 m
  • Other dimensions available in cooperation with external partners

Cable Manufacturing

  • Bundled straight wires
  • Coil winding cables
  • Ribbon cables

Research Standard Connectity

  • ZIF connectors
  • Omnetics connectors
  • Harwin connectors
  • Molex connectors
  • Other connector types can be attached upon request
  • Open cable ends – for highest flexibility in individual interconnection applications

Medical Standard Connectity

  • IS-1
  • IS-4
  • DF-1
  • DF-4
  • Bal Seal

Interconnection Technologies

  • Ball-stud bonding
    Interconnection option for connecting electrode arrays to printed circuit boards (PCB)
  • Laser welding
    Common method for connecting wires to metal parts such as sleeves or platelets
  • Spot welding
    Common method for connecting wires to laser-patterned metal foil
    (e.g., contact area of AirRay™ electrodes)
  • Parallel gap welding
    Standard interconnection for connecting wires to PCBs
  • Micro soldering
    Standard procedure for connecting wires to connectors or PCBs

Get all Information at a Glance

Click here to download the Datasheet for our Interconnection Technology.

More technical Information



  • Platinum-Iridium (90/10)
  • MP35N
  • MP-DFT Ag (silver core)
  • Gold


  • Polyesterimide
  • Fluorpolymer
  • Silicone


  • Printed Circuit Board, e.g. FR4
  • Screen printed ceramics
  • Other materials upon request


Our interconnections are tested to fulfill different standards in the medical device industry (e.g. EN 45502-2-3 or ISO 14708-1) to guarantee highest reliability.


Mechanical Characterization

  • Bending tests (cyclic loads)

  • Tensile or shear tests

For particularly challenging mechanical requirements we are happy to engineer strain relieving concepts for your individual interconnection solution.


Electrochemical Characterization

  • Impedance analysis (usually together with electrodes)

  • Corrosion tests

Related Services

  • Functionality testing
  • Electrochemical testing
  • Mechanical testing
  • Aging and accelerated aging tests
  • Reliability testing
  • Tests and validations incl. technical documentation
  • Customized interconnections
  • Design studies
  • Process validation
  • More connectivity options in cooperation with external partners


CorTec electronics department develops circuitry for active implanted medical devices and their corresponding body-external telemetry units incorporating all relevant electromagnetic compliance and patient safety requirements.

Hermetic Encapsulation

Our ceramic encapsulation technology is the first packaging solution for implants with a very high channel count available on the market. Designed according to your requirements it ensures a protection of the implant electronics for decades.


We are developing medical device grade software according to IEC 62304. The development ranges from windows-based application software to embedded systems programming.

Discover our other services


With our patented °AirRay electrode technology we have overcome current limitations of electrodes.

Based on our laser-aided manufacturing process we can design and manufacture electrodes according to your actual requirements – in any geometrical shape, with hundreds of contacts, and for numerous applications.

Learn more

Complete System

CorTec Brain Interchange ONE joins the scope of our competences interconnecting the neural system to artificial intelligence.

The fully implantable system for recording and stimulation both on 32 channels enables open and closed loop interaction with the nervous system.

Learn more


Our Service

Our services include all important steps from providing solutions how to realize your idea of a product over development and testing up to manufacturing the approved medical device.

With our application-related, technological, and regulatory know-how we support every step on the way to your implant.

Learn more

Download our catalogue

All information about our technologies at a glance. Click here to download our new CorTec Business Catalogue.


Through our quality management system, we meet the highest requirements of the applicable standards.

CorTec is DIN EN ISO 13485 certified and has high-class clean rooms.


You would like to hear a second opinion?

Read more about the experiences of our customers with our products and services in our Reference Section.